Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications

Ph.D

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Bibliographic Details
Main Author:	SIVA SURI CHANDRA RAO BHESETTI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2013
Subjects:	Mechanical properties, Lead-free solder, Intermetallic compounds, Nanoindentation, Creep, Microbump Joints
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/37602
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-37602
record_format	dspace
spelling	sg-nus-scholar.10635-376022015-01-16T06:43:00Z Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications SIVA SURI CHANDRA RAO BHESETTI MECHANICAL ENGINEERING ZENG KAIYANG VAIDYANATHAN KRIPESH Mechanical properties, Lead-free solder, Intermetallic compounds, Nanoindentation, Creep, Microbump Joints Ph.D DOCTOR OF PHILOSOPHY 2013-04-30T18:02:03Z 2013-04-30T18:02:03Z 2012-08-15 Thesis SIVA SURI CHANDRA RAO BHESETTI (2012-08-15). Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/37602 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Mechanical properties, Lead-free solder, Intermetallic compounds, Nanoindentation, Creep, Microbump Joints
spellingShingle	Mechanical properties, Lead-free solder, Intermetallic compounds, Nanoindentation, Creep, Microbump Joints SIVA SURI CHANDRA RAO BHESETTI Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING SIVA SURI CHANDRA RAO BHESETTI
format	Theses and Dissertations
author	SIVA SURI CHANDRA RAO BHESETTI
author_sort	SIVA SURI CHANDRA RAO BHESETTI
title	Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
title_short	Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
title_full	Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
title_fullStr	Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
title_full_unstemmed	Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications
title_sort	micromechanical behaviour of lead-free solder joints developed for 3d-ic packaging applications
publishDate	2013
url	http://scholarbank.nus.edu.sg/handle/10635/37602
_version_	1681081840573612032

Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications

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