Micromechanical Behaviour of Lead-free Solder Joints Developed for 3D-IC Packaging Applications

Ph.D

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Bibliographic Details
Main Author:	SIVA SURI CHANDRA RAO BHESETTI
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2013
Subjects:	Mechanical properties, Lead-free solder, Intermetallic compounds, Nanoindentation, Creep, Microbump Joints
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/37602
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Institution:	National University of Singapore
Language:	English

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