Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

10.1016/j.mee.2010.04.017

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Bibliographic Details
Main Authors:	Chandra Rao, B.S.S., Weng, J., Shen, L., Lee, T.K., Zeng, K.Y.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Elastic modulus Hardness Intermetallics Lead-free solder joints Nanoindentation
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85436
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85436
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spelling	sg-nus-scholar.10635-854362023-10-29T21:37:03Z Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints Chandra Rao, B.S.S. Weng, J. Shen, L. Lee, T.K. Zeng, K.Y. MECHANICAL ENGINEERING Elastic modulus Hardness Intermetallics Lead-free solder joints Nanoindentation 10.1016/j.mee.2010.04.017 Microelectronic Engineering 87 11 2416-2422 MIENE 2014-10-07T09:07:59Z 2014-10-07T09:07:59Z 2010-11 Article Chandra Rao, B.S.S., Weng, J., Shen, L., Lee, T.K., Zeng, K.Y. (2010-11). Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints. Microelectronic Engineering 87 (11) : 2416-2422. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2010.04.017 01679317 http://scholarbank.nus.edu.sg/handle/10635/85436 000281420900068 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Elastic modulus Hardness Intermetallics Lead-free solder joints Nanoindentation
spellingShingle	Elastic modulus Hardness Intermetallics Lead-free solder joints Nanoindentation Chandra Rao, B.S.S. Weng, J. Shen, L. Lee, T.K. Zeng, K.Y. Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
description	10.1016/j.mee.2010.04.017
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Chandra Rao, B.S.S. Weng, J. Shen, L. Lee, T.K. Zeng, K.Y.
format	Article
author	Chandra Rao, B.S.S. Weng, J. Shen, L. Lee, T.K. Zeng, K.Y.
author_sort	Chandra Rao, B.S.S.
title	Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
title_short	Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
title_full	Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
title_fullStr	Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
title_full_unstemmed	Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints
title_sort	morphology and mechanical properties of intermetallic compounds in snagcu solder joints
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85436
_version_	1781784674317631488

Morphology and mechanical properties of intermetallic compounds in SnAgCu solder joints

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