Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites

Materials Science and Technology Conference and Exhibition, MS and T'08

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書目詳細資料
Main Authors: Gupta, M., Nai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P.
其他作者: CIVIL ENGINEERING
格式: Conference or Workshop Item
出版: 2014
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在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/73995
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機構: National University of Singapore