Enhancing mechanical response of a 96.5Sn-3.0Ag-0.5Cu solder using energy efficient microwave assisted sintering route

The Minerals, Metals and Materials Society - 3rd International Conference on Processing Materials for Properties 2008, PMP III

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Bibliographic Details
Main Authors: Nai, S.M.L., Kuma, J.V.M., Gupta, M.
Other Authors: CIVIL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73433
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Institution: National University of Singapore