Development of high strength Sn-Cu solder using copper particles at nanolength scale

10.1016/j.jallcom.2008.09.061

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Bibliographic Details
Main Authors: Alam, M.E., Nai, S.M.L., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59934
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Institution: National University of Singapore