Development of high strength Sn-Cu solder using copper particles at nanolength scale

10.1016/j.jallcom.2008.09.061

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Bibliographic Details
Main Authors:	Alam, M.E., Nai, S.M.L., Gupta, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Mechanical properties Microstructure Powder metallurgy Sintering
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59934
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-59934
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spelling	sg-nus-scholar.10635-599342023-10-27T07:24:14Z Development of high strength Sn-Cu solder using copper particles at nanolength scale Alam, M.E. Nai, S.M.L. Gupta, M. MECHANICAL ENGINEERING Mechanical properties Microstructure Powder metallurgy Sintering 10.1016/j.jallcom.2008.09.061 Journal of Alloys and Compounds 476 1-2 199-206 JALCE 2014-06-17T06:17:17Z 2014-06-17T06:17:17Z 2009-05-12 Article Alam, M.E., Nai, S.M.L., Gupta, M. (2009-05-12). Development of high strength Sn-Cu solder using copper particles at nanolength scale. Journal of Alloys and Compounds 476 (1-2) : 199-206. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jallcom.2008.09.061 09258388 http://scholarbank.nus.edu.sg/handle/10635/59934 000266117900043 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Mechanical properties Microstructure Powder metallurgy Sintering
spellingShingle	Mechanical properties Microstructure Powder metallurgy Sintering Alam, M.E. Nai, S.M.L. Gupta, M. Development of high strength Sn-Cu solder using copper particles at nanolength scale
description	10.1016/j.jallcom.2008.09.061
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Alam, M.E. Nai, S.M.L. Gupta, M.
format	Article
author	Alam, M.E. Nai, S.M.L. Gupta, M.
author_sort	Alam, M.E.
title	Development of high strength Sn-Cu solder using copper particles at nanolength scale
title_short	Development of high strength Sn-Cu solder using copper particles at nanolength scale
title_full	Development of high strength Sn-Cu solder using copper particles at nanolength scale
title_fullStr	Development of high strength Sn-Cu solder using copper particles at nanolength scale
title_full_unstemmed	Development of high strength Sn-Cu solder using copper particles at nanolength scale
title_sort	development of high strength sn-cu solder using copper particles at nanolength scale
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/59934
_version_	1781781732224139264

Development of high strength Sn-Cu solder using copper particles at nanolength scale

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