Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion

Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion

TMS Annual Meeting

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Bibliographic Details
Main Authors: Alam, M.E., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Extrusion temperature
Powder metallurgy
Tensile properties.
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73434
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73434

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