Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion

TMS Annual Meeting

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Bibliographic Details
Main Authors: Alam, M.E., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73434
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Institution: National University of Singapore
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Summary:TMS Annual Meeting