Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion

TMS Annual Meeting

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Bibliographic Details
Main Authors:	Alam, M.E., Gupta, M.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Extrusion temperature Powder metallurgy Tensile properties.
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73434
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73434
record_format	dspace
spelling	sg-nus-scholar.10635-734342015-04-16T19:15:02Z Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion Alam, M.E. Gupta, M. MECHANICAL ENGINEERING Extrusion temperature Powder metallurgy Tensile properties. TMS Annual Meeting 661-668 85MVA 2014-06-19T05:35:04Z 2014-06-19T05:35:04Z 2009 Conference Paper Alam, M.E.,Gupta, M. (2009). Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion. TMS Annual Meeting : 661-668. ScholarBank@NUS Repository. 9780873397353 http://scholarbank.nus.edu.sg/handle/10635/73434 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Extrusion temperature Powder metallurgy Tensile properties.
spellingShingle	Extrusion temperature Powder metallurgy Tensile properties. Alam, M.E. Gupta, M. Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
description	TMS Annual Meeting
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Alam, M.E. Gupta, M.
format	Conference or Workshop Item
author	Alam, M.E. Gupta, M.
author_sort	Alam, M.E.
title	Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
title_short	Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
title_full	Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
title_fullStr	Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
title_full_unstemmed	Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion
title_sort	enhancing tensile response of sn using cu at nano length scale and high temperature extrusion
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73434
_version_	1681087747523084288

Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion

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