Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites

Materials Science and Technology Conference and Exhibition, MS and T'08

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Bibliographic Details
Main Authors:	Gupta, M., Nai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P.
Other Authors:	CIVIL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Lead-free solder Metal-matrix nanocomposite Microwave sintering Tensile properties
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73995
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73995
record_format	dspace
spelling	sg-nus-scholar.10635-739952015-02-21T01:33:48Z Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites Gupta, M. Nai, S.M.L. Kuma, J.V.M. Alam, M.E. Zhong, X.L. Babaghorbani, P. CIVIL ENGINEERING MECHANICAL ENGINEERING Lead-free solder Metal-matrix nanocomposite Microwave sintering Tensile properties Materials Science and Technology Conference and Exhibition, MS and T'08 4 2641-2651 2014-06-19T05:41:51Z 2014-06-19T05:41:51Z 2008 Conference Paper Gupta, M.,Nai, S.M.L.,Kuma, J.V.M.,Alam, M.E.,Zhong, X.L.,Babaghorbani, P. (2008). Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites. Materials Science and Technology Conference and Exhibition, MS and T'08 4 : 2641-2651. ScholarBank@NUS Repository. 9781605606217 http://scholarbank.nus.edu.sg/handle/10635/73995 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Lead-free solder Metal-matrix nanocomposite Microwave sintering Tensile properties
spellingShingle	Lead-free solder Metal-matrix nanocomposite Microwave sintering Tensile properties Gupta, M. Nai, S.M.L. Kuma, J.V.M. Alam, M.E. Zhong, X.L. Babaghorbani, P. Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
description	Materials Science and Technology Conference and Exhibition, MS and T'08
author2	CIVIL ENGINEERING
author_facet	CIVIL ENGINEERING Gupta, M. Nai, S.M.L. Kuma, J.V.M. Alam, M.E. Zhong, X.L. Babaghorbani, P.
format	Conference or Workshop Item
author	Gupta, M. Nai, S.M.L. Kuma, J.V.M. Alam, M.E. Zhong, X.L. Babaghorbani, P.
author_sort	Gupta, M.
title	Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
title_short	Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
title_full	Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
title_fullStr	Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
title_full_unstemmed	Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
title_sort	using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73995
_version_	1681087849162604544

Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites

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