Using microwave assisted powder metallurgy route and nano-size reinforcements to develop high strength lead-free solder composites

Materials Science and Technology Conference and Exhibition, MS and T'08

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Bibliographic Details
Main Authors: Gupta, M., Nai, S.M.L., Kuma, J.V.M., Alam, M.E., Zhong, X.L., Babaghorbani, P.
Other Authors: CIVIL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73995
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Institution: National University of Singapore
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