Using nanoparticles and carbon nanotubes to enhance the properties of a lead-free solder

Using nanoparticles and carbon nanotubes to enhance the properties of a lead-free solder

Technical Proceedings of the 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009

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Bibliographic Details
Main Authors: Nai, S.M.L., Han, Y.D., Jing, H.Y., Tan, C.M., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Carbon nanotubes
Composites
Lead-free solder
Nanoparticles
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86108
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/86108

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