Using nanoparticles and carbon nanotubes to enhance the properties of a lead-free solder
Technical Proceedings of the 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009
Saved in:
Main Authors: | Nai, S.M.L., Han, Y.D., Jing, H.Y., Tan, C.M., Wei, J., Gupta, M. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/86108 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Lead-free solder reinforced with multiwalled carbon nanotubes
by: Nai, S.M.L., et al.
Published: (2014) -
Using carbon nanotubes to enhance creep performance of lead free solder
by: Nai, S.M.L., et al.
Published: (2014) -
Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes
by: Nai, S.M.L., et al.
Published: (2014) -
Evelopment of novel lead-free solder composites using carbon nanotube reinforcements
by: Nai, S.M.L., et al.
Published: (2014) -
Effect of carbon nanotubes on the shear Strength and electrical resistivity of a lead-free solder
by: Nai, S.M.L., et al.
Published: (2014)