Interfacial intermetallic growth and shear strength of lead-free composite solder joints

Interfacial intermetallic growth and shear strength of lead-free composite solder joints

10.1016/j.jallcom.2008.05.070

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Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Intermetallics
Mechanical properties
Metal matrix composites
Scanning electron microscopy
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60588
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/60588

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