APA引文

Nai, S., Wei, J., Gupta, M., & ENGINEERING, M. (2014). Interfacial intermetallic growth and shear strength of lead-free composite solder joints.

Chicago Style Citation

Nai, S.M.L., J. Wei, M. Gupta, and MECHANICAL ENGINEERING. Interfacial Intermetallic Growth and Shear Strength of Lead-free Composite Solder Joints. 2014.

MLA引文

Nai, S.M.L., J. Wei, M. Gupta, and MECHANICAL ENGINEERING. Interfacial Intermetallic Growth and Shear Strength of Lead-free Composite Solder Joints. 2014.

警告：這些引文格式不一定是100％准確.