Interfacial intermetallic growth and shear strength of lead-free composite solder joints

Interfacial intermetallic growth and shear strength of lead-free composite solder joints

10.1016/j.jallcom.2008.05.070

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書目詳細資料
Main Authors:	Nai, S.M.L., Wei, J., Gupta, M.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Intermetallics Mechanical properties Metal matrix composites Scanning electron microscopy
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/60588
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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