Interfacial intermetallic growth and shear strength of lead-free composite solder joints

• Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
• 其他作者: MECHANICAL ENGINEERING
• 格式: Article
• 出版: 2014
• 主題: Intermetallics; Mechanical properties; Metal matrix composites; Scanning electron microscopy
• 在線閱讀: http://scholarbank.nus.edu.sg/handle/10635/60588
• 機構: National University of Singapore

10.1016/j.jallcom.2008.05.070