Interfacial intermetallic growth and shear strength of lead-free composite solder joints

Interfacial intermetallic growth and shear strength of lead-free composite solder joints

10.1016/j.jallcom.2008.05.070

Saved in:
Bibliographic Details
Main Authors: Nai, S.M.L., Wei, J., Gupta, M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Intermetallics
Mechanical properties
Metal matrix composites
Scanning electron microscopy
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60588
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-60588
record_format dspace
spelling sg-nus-scholar.10635-605882023-11-01T07:10:46Z Interfacial intermetallic growth and shear strength of lead-free composite solder joints Nai, S.M.L. Wei, J. Gupta, M. MECHANICAL ENGINEERING Intermetallics Mechanical properties Metal matrix composites Scanning electron microscopy 10.1016/j.jallcom.2008.05.070 Journal of Alloys and Compounds 473 1-2 100-106 JALCE 2014-06-17T06:25:01Z 2014-06-17T06:25:01Z 2009-04-03 Article Nai, S.M.L., Wei, J., Gupta, M. (2009-04-03). Interfacial intermetallic growth and shear strength of lead-free composite solder joints. Journal of Alloys and Compounds 473 (1-2) : 100-106. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jallcom.2008.05.070 09258388 http://scholarbank.nus.edu.sg/handle/10635/60588 000264890500028 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Intermetallics
Mechanical properties
Metal matrix composites
Scanning electron microscopy
spellingShingle Intermetallics
Mechanical properties
Metal matrix composites
Scanning electron microscopy
Nai, S.M.L.
Wei, J.
Gupta, M.
Interfacial intermetallic growth and shear strength of lead-free composite solder joints
description 10.1016/j.jallcom.2008.05.070
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Nai, S.M.L.
Wei, J.
Gupta, M.
format Article
author Nai, S.M.L.
Wei, J.
Gupta, M.
author_sort Nai, S.M.L.
title Interfacial intermetallic growth and shear strength of lead-free composite solder joints
title_short Interfacial intermetallic growth and shear strength of lead-free composite solder joints
title_full Interfacial intermetallic growth and shear strength of lead-free composite solder joints
title_fullStr Interfacial intermetallic growth and shear strength of lead-free composite solder joints
title_full_unstemmed Interfacial intermetallic growth and shear strength of lead-free composite solder joints
title_sort interfacial intermetallic growth and shear strength of lead-free composite solder joints
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/60588
_version_ 1781781875324354560

Similar Items