Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading

Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading

10.1016/j.scriptamat.2008.08.020

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Bibliographic Details
Main Authors: Seah, S.K.W., Wong, E.H., Shim, V.P.W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Drop impact
Electronic packaging
Fatigue crack propagation
Lead-free solder
Low cycle fatigue
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60301
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/60301

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