Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading

10.1016/j.scriptamat.2008.08.020

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Main Authors: Seah, S.K.W., Wong, E.H., Shim, V.P.W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/60301
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-603012023-10-25T21:38:20Z Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading Seah, S.K.W. Wong, E.H. Shim, V.P.W. MECHANICAL ENGINEERING Drop impact Electronic packaging Fatigue crack propagation Lead-free solder Low cycle fatigue 10.1016/j.scriptamat.2008.08.020 Scripta Materialia 59 12 1239-1242 SCMAF 2014-06-17T06:21:36Z 2014-06-17T06:21:36Z 2008-12 Article Seah, S.K.W., Wong, E.H., Shim, V.P.W. (2008-12). Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading. Scripta Materialia 59 (12) : 1239-1242. ScholarBank@NUS Repository. https://doi.org/10.1016/j.scriptamat.2008.08.020 13596462 http://scholarbank.nus.edu.sg/handle/10635/60301 000261007400003 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Drop impact
Electronic packaging
Fatigue crack propagation
Lead-free solder
Low cycle fatigue
spellingShingle Drop impact
Electronic packaging
Fatigue crack propagation
Lead-free solder
Low cycle fatigue
Seah, S.K.W.
Wong, E.H.
Shim, V.P.W.
Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
description 10.1016/j.scriptamat.2008.08.020
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Seah, S.K.W.
Wong, E.H.
Shim, V.P.W.
format Article
author Seah, S.K.W.
Wong, E.H.
Shim, V.P.W.
author_sort Seah, S.K.W.
title Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
title_short Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
title_full Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
title_fullStr Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
title_full_unstemmed Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
title_sort fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/60301
_version_ 1781781808865607680