Modelling fatigue life of solder joints in wafer level packages

Modelling fatigue life of solder joints in wafer level packages

Master's

Saved in:
Bibliographic Details
Main Author: CHNG CHIA-K'AI, AUDREY
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect
Online Access:http://scholarbank.nus.edu.sg/handle/10635/13618
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Language: English

Internet

http://scholarbank.nus.edu.sg/handle/10635/13618

Similar Items