Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling

Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling

10.1109/TCAPT.2006.880509

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Flip-chip
Multicopper-column (MCC) interconnect
Solder bridging
Soler joint shape
Terms-Fatigue
Wafer-level packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60299
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/60299

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