Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

10.1016/j.chemosphere.2006.02.010

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S., Feng, H.H., Nagarajan, R., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Compliance
Electrical parasitic
Flip-chip
Multicopper-column interconnect
Wafer-level packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60918
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/60918

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