Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects

by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V.
Published 2014

Fabrication and parametric study of wafer-level multiple-copper-column interconnect

by Liao, E.B., Ang, S.S., Tay, A.A.O., Feng, H.H., Nagarajan, R., Kripesh, V.
Published 2014

Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling

by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V.
Published 2014

Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

by Liao, E.B., Tay, A.A.O., Ang, S.S., Feng, H.H., Nagarajan, R., Kripesh, V.
Published 2014

Etching control of benzocyclobutene in CF4 / O2 and SF6 / O2 plasmas with thick photoresist and titanium masks

by Liao, E.B., Teh, W.H., Teoh, K.W., Tay, A.A.O., Feng, H.H., Kumar, R.
Published 2014

Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Mahadevan, I.
Published 2014

A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K.
Published 2014

Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging

by Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Lo, G.Q.
Published 2014