A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

10.1109/ECTC.2006.1645812

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73039
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/73039

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