Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Saved in:
Bibliographic Details
Main Authors: Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73988
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73988

Similar Items