Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors:	Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73988
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73988
record_format	dspace
spelling	sg-nus-scholar.10635-739882015-01-29T07:22:11Z Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects Aggarwal, A.O. Raj, P.M. Sacks, M.D. Tay, A.A.O. Tummala, R.R. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 132-137 2014-06-19T05:41:47Z 2014-06-19T05:41:47Z 2004 Conference Paper Aggarwal, A.O.,Raj, P.M.,Sacks, M.D.,Tay, A.A.O.,Tummala, R.R. (2004). Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 132-137. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73988 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Aggarwal, A.O. Raj, P.M. Sacks, M.D. Tay, A.A.O. Tummala, R.R.
format	Conference or Workshop Item
author	Aggarwal, A.O. Raj, P.M. Sacks, M.D. Tay, A.A.O. Tummala, R.R.
spellingShingle	Aggarwal, A.O. Raj, P.M. Sacks, M.D. Tay, A.A.O. Tummala, R.R. Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
author_sort	Aggarwal, A.O.
title	Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
title_short	Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
title_full	Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
title_fullStr	Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
title_full_unstemmed	Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
title_sort	ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73988
_version_	1681087847904313344

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

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