The importance of allowing for the variation of thermal properties in the numerical computation of temperature distribution in machining

بواسطة Tay, A.A.O.
منشور في 2014

Fracture mechanics analysis of delamination failures in I'C packages

بواسطة Tay, A.A.O.
منشور في 2014

Influence of temperature humidity and defect location on delamination in plastic 1c packages

بواسطة Tay, A.A.O.
منشور في 2014

Modeling of delamination in IC packages

بواسطة Tay, A.A.O.
منشور في 2014

Mechanics of interfacial delamination in IC packages undergoing solder reflow

بواسطة Tay, A.A.O.
منشور في 2014

Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages

بواسطة Tay, A.A.O.
منشور في 2014

Modeling of interfacial delamination in plastic IC packages under hygrothermal loading

بواسطة Tay, A.A.O.
منشور في 2014

A review of methods of calculating machining temperature

بواسطة Tay, A.A.O.
منشور في 2014

The role of simulation in failure prediction and design optimization in electronics packaging

بواسطة Tay, A.A.O.
منشور في 2014

Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design

بواسطة Tay, A.A.O., Wei, S.
منشور في 2014

A study of the effect of exit boundary conditions on the performance of a spray cooling system

بواسطة Somasundaram, S., Tay, A.A.O.
منشور في 2014

Testing of two different types of photovoltaic-thermal (PVT) modules with heat flow pattern under tropical climatic conditions

بواسطة Dubey, S., Tay, A.A.O.
منشور في 2014

Moisture diffusion and heat transfer in plastic IC packages

بواسطة Tay, A.A.O., Lin, T.
منشور في 2014

Intermittent spray cooling - Solution to optimize spray cooling

بواسطة Somasundaram, S., Tay, A.A.O.
منشور في 2014

Performance study and economic analysis of photo-voltaic thermal system under real-life thermal loads in tropical climate

بواسطة Somasundaram, S., Tay, A.A.O.
منشور في 2022

The theoretical modelling and optimization of a 10 KWP photovoltaic thermal system for a student hostel in Singapore

بواسطة Dubey, S., Tay, A.A.O.
منشور في 2014

Measurement of heat transfer coefficient in spray cooling of a flip chip

بواسطة Tay, A.A.O., Somasundaram, S.
منشور في 2014

An experimental study of closed loop intermittent spray cooling of ICs

بواسطة Somasundaram, S., Tay, A.A.O.
منشور في 2014

A study of intermittent spray cooling process through application of a sequential function specification method

بواسطة Somasundaram, S., Tay, A.A.O.
منشور في 2014

Measurement of thermal resistance of TIMs, heat sinks and interfaces in thermal management systems for IC packages

بواسطة Somasundaram, S., Tay, A.A.O.
منشور في 2014