Measurement of thermal resistance of TIMs, heat sinks and interfaces in thermal management systems for IC packages

Measurement of thermal resistance of TIMs, heat sinks and interfaces in thermal management systems for IC packages

10.1109/IEMT.2010.5746715

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Bibliographic Details
Main Authors: Somasundaram, S., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86016
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/86016

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