Somasundaram, S., Tay, A., & ENGINEERING, M. (2014). Measurement of thermal resistance of TIMs, heat sinks and interfaces in thermal management systems for IC packages.
استشهاد بنمط شيكاغوSomasundaram, S., A.A.O Tay, و MECHANICAL ENGINEERING. Measurement of Thermal Resistance of TIMs, Heat Sinks and Interfaces in Thermal Management Systems for IC Packages. 2014.
MLA استشهادSomasundaram, S., A.A.O Tay, و MECHANICAL ENGINEERING. Measurement of Thermal Resistance of TIMs, Heat Sinks and Interfaces in Thermal Management Systems for IC Packages. 2014.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.