Design and development of interconnects for ultra-fine pitch wafer level packages
10.1109/ICEPT.2005.1564732
Saved in:
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73317 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |