Design and development of interconnects for ultra-fine pitch wafer level packages
10.1109/ICEPT.2005.1564732
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sg-nus-scholar.10635-733172015-03-23T20:31:43Z Design and development of interconnects for ultra-fine pitch wafer level packages Tay, A.A.O. Iyer, M.K. Tummala, R.R. MECHANICAL ENGINEERING 10.1109/ICEPT.2005.1564732 2005 6th International Conference on Electronics Packaging Technology 2005 - 2014-06-19T05:33:41Z 2014-06-19T05:33:41Z 2005 Conference Paper Tay, A.A.O.,Iyer, M.K.,Tummala, R.R. (2005). Design and development of interconnects for ultra-fine pitch wafer level packages. 2005 6th International Conference on Electronics Packaging Technology 2005 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICEPT.2005.1564732" target="_blank">https://doi.org/10.1109/ICEPT.2005.1564732</a> 0780394496 http://scholarbank.nus.edu.sg/handle/10635/73317 NOT_IN_WOS Scopus |
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10.1109/ICEPT.2005.1564732 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Tay, A.A.O. Iyer, M.K. Tummala, R.R. |
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Conference or Workshop Item |
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Tay, A.A.O. Iyer, M.K. Tummala, R.R. |
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Tay, A.A.O. Iyer, M.K. Tummala, R.R. Design and development of interconnects for ultra-fine pitch wafer level packages |
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Tay, A.A.O. |
title |
Design and development of interconnects for ultra-fine pitch wafer level packages |
title_short |
Design and development of interconnects for ultra-fine pitch wafer level packages |
title_full |
Design and development of interconnects for ultra-fine pitch wafer level packages |
title_fullStr |
Design and development of interconnects for ultra-fine pitch wafer level packages |
title_full_unstemmed |
Design and development of interconnects for ultra-fine pitch wafer level packages |
title_sort |
design and development of interconnects for ultra-fine pitch wafer level packages |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73317 |
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