Design and development of interconnects for ultra-fine pitch wafer level packages

10.1109/ICEPT.2005.1564732

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Bibliographic Details
Main Authors: Tay, A.A.O., Iyer, M.K., Tummala, R.R.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73317
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-733172015-03-23T20:31:43Z Design and development of interconnects for ultra-fine pitch wafer level packages Tay, A.A.O. Iyer, M.K. Tummala, R.R. MECHANICAL ENGINEERING 10.1109/ICEPT.2005.1564732 2005 6th International Conference on Electronics Packaging Technology 2005 - 2014-06-19T05:33:41Z 2014-06-19T05:33:41Z 2005 Conference Paper Tay, A.A.O.,Iyer, M.K.,Tummala, R.R. (2005). Design and development of interconnects for ultra-fine pitch wafer level packages. 2005 6th International Conference on Electronics Packaging Technology 2005 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICEPT.2005.1564732" target="_blank">https://doi.org/10.1109/ICEPT.2005.1564732</a> 0780394496 http://scholarbank.nus.edu.sg/handle/10635/73317 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 10.1109/ICEPT.2005.1564732
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Tay, A.A.O.
Iyer, M.K.
Tummala, R.R.
format Conference or Workshop Item
author Tay, A.A.O.
Iyer, M.K.
Tummala, R.R.
spellingShingle Tay, A.A.O.
Iyer, M.K.
Tummala, R.R.
Design and development of interconnects for ultra-fine pitch wafer level packages
author_sort Tay, A.A.O.
title Design and development of interconnects for ultra-fine pitch wafer level packages
title_short Design and development of interconnects for ultra-fine pitch wafer level packages
title_full Design and development of interconnects for ultra-fine pitch wafer level packages
title_fullStr Design and development of interconnects for ultra-fine pitch wafer level packages
title_full_unstemmed Design and development of interconnects for ultra-fine pitch wafer level packages
title_sort design and development of interconnects for ultra-fine pitch wafer level packages
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73317
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