Design and development of interconnects for ultra-fine pitch wafer level packages

Design and development of interconnects for ultra-fine pitch wafer level packages

10.1109/ICEPT.2005.1564732

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Bibliographic Details
Main Authors: Tay, A.A.O., Iyer, M.K., Tummala, R.R.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73317
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Institution: National University of Singapore
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Summary:10.1109/ICEPT.2005.1564732

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