APA Citation

Tay, A., Iyer, M., Tummala, R., & ENGINEERING, M. (2014). Design and development of interconnects for ultra-fine pitch wafer level packages.

Chicago Style Citation

Tay, A.A.O., M.K Iyer, R.R Tummala, and MECHANICAL ENGINEERING. Design and Development of Interconnects for Ultra-fine Pitch Wafer Level Packages. 2014.

MLA Citation

Tay, A.A.O., M.K Iyer, R.R Tummala, and MECHANICAL ENGINEERING. Design and Development of Interconnects for Ultra-fine Pitch Wafer Level Packages. 2014.

Warning: These citations may not always be 100% accurate.