Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

Ultra fine-pitch wafer level packaging with reworkable composite nano-interconnects

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Aggarwal, A.O., Raj, P.M., Sacks, M.D., Tay, A.A.O., Tummala, R.R.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73988
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Institution: National University of Singapore
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Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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