A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

• Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73039
• Institution: National University of Singapore

10.1109/ECTC.2006.1645812