A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

10.1109/ECTC.2006.1645812

Saved in:

Bibliographic Details
Main Authors:	Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73039
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-73039
record_format	dspace
spelling	sg-nus-scholar.10635-730392023-10-30T21:39:38Z A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Iyer, M.K. MECHANICAL ENGINEERING 10.1109/ECTC.2006.1645812 Proceedings - Electronic Components and Technology Conference 2006 1246-1250 PECCA 2014-06-19T05:30:28Z 2014-06-19T05:30:28Z 2006 Conference Paper Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Iyer, M.K. (2006). A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1246-1250. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645812 1424401526 05695503 http://scholarbank.nus.edu.sg/handle/10635/73039 000238566601021 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/ECTC.2006.1645812
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Iyer, M.K.
format	Conference or Workshop Item
author	Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Iyer, M.K.
spellingShingle	Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Iyer, M.K. A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
author_sort	Liao, E.B.
title	A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
title_short	A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
title_full	A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
title_fullStr	A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
title_full_unstemmed	A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
title_sort	mems-based compliant interconnect for ultra-fine-pitch wafer level packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73039
_version_	1781783272298119168

A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging

Similar Items