Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects

Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73412
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/73412

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