Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Saved in:

Bibliographic Details
Main Authors:	Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73412
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-73412
record_format	dspace
spelling	sg-nus-scholar.10635-734122015-01-12T05:12:57Z Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 115-119 2014-06-19T05:34:48Z 2014-06-19T05:34:48Z 2004 Conference Paper Liao, E.B.,Tay, A.A.O.,Ang, S.S.T.,Feng, H.H.,Nagarajan, R.,Kripesh, V. (2004). Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 115-119. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73412 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V.
format	Conference or Workshop Item
author	Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V.
spellingShingle	Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
author_sort	Liao, E.B.
title	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
title_short	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
title_full	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
title_fullStr	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
title_full_unstemmed	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
title_sort	effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73412
_version_	1681087743480823808

Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects

Similar Items