Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications

Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications

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Bibliographic Details
Main Author: VEMPATI SRINIVASARAO
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Fine pitch interconnects, Copper column interconnects, Flip-chip interconnects, Thick photoresist process, Wafer level packaging, Advanced packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/15010
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Institution: National University of Singapore
Language: English

Internet

http://scholarbank.nus.edu.sg/handle/10635/15010

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