Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications

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Main Author:	VEMPATI SRINIVASARAO
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Fine pitch interconnects, Copper column interconnects, Flip-chip interconnects, Thick photoresist process, Wafer level packaging, Advanced packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/15010
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-15010
record_format	dspace
spelling	sg-nus-scholar.10635-150102017-10-21T09:37:42Z Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications VEMPATI SRINIVASARAO MECHANICAL ENGINEERING TAY AH ONG, ANDREW LIM CHWEE TECK Fine pitch interconnects, Copper column interconnects, Flip-chip interconnects, Thick photoresist process, Wafer level packaging, Advanced packaging Master's MASTER OF ENGINEERING 2010-04-08T10:49:08Z 2010-04-08T10:49:08Z 2005-09-08 Thesis VEMPATI SRINIVASARAO (2005-09-08). Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/15010 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Fine pitch interconnects, Copper column interconnects, Flip-chip interconnects, Thick photoresist process, Wafer level packaging, Advanced packaging
spellingShingle	Fine pitch interconnects, Copper column interconnects, Flip-chip interconnects, Thick photoresist process, Wafer level packaging, Advanced packaging VEMPATI SRINIVASARAO Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING VEMPATI SRINIVASARAO
format	Theses and Dissertations
author	VEMPATI SRINIVASARAO
author_sort	VEMPATI SRINIVASARAO
title	Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
title_short	Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
title_full	Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
title_fullStr	Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
title_full_unstemmed	Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
title_sort	bed of nails(b0n) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/15010
_version_	1681079122815614976

Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications

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