Bed of nails(B0N) - 100 microns pitch wafer level off-chip interconnects for microelectronic packaging applications

• Main Author: VEMPATI SRINIVASARAO
• Other Authors: MECHANICAL ENGINEERING
• Format: Theses and Dissertations
• Language: English
• Published: 2010
• Subjects: Fine pitch interconnects, Copper column interconnects, Flip-chip interconnects, Thick photoresist process, Wafer level packaging, Advanced packaging
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/15010
• Institution: National University of Singapore

Master's