Bed of nails - 100-μm-pitch wafer-level interconnections process

Bed of nails - 100-μm-pitch wafer-level interconnections process

10.1109/TEPM.2008.2004500

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Bibliographic Details
Main Authors: Vempati, S.R., Tay, A.A.O., Kripesh, V., Yoon, S.W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Failure analysis
Packaging
Photolithography
Reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84883
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/84883

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