Bed of nails - 100-μm-pitch wafer-level interconnections process

Bed of nails - 100-μm-pitch wafer-level interconnections process

10.1109/TEPM.2008.2004500

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Bibliographic Details
Main Authors: Vempati, S.R., Tay, A.A.O., Kripesh, V., Yoon, S.W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Failure analysis
Packaging
Photolithography
Reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84883
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Institution: National University of Singapore
id sg-nus-scholar.10635-84883
record_format dspace
spelling sg-nus-scholar.10635-848832023-10-25T22:55:02Z Bed of nails - 100-μm-pitch wafer-level interconnections process Vempati, S.R. Tay, A.A.O. Kripesh, V. Yoon, S.W. MECHANICAL ENGINEERING Failure analysis Packaging Photolithography Reliability 10.1109/TEPM.2008.2004500 IEEE Transactions on Electronics Packaging Manufacturing 31 4 333-340 ITEPF 2014-10-07T09:01:24Z 2014-10-07T09:01:24Z 2008 Article Vempati, S.R., Tay, A.A.O., Kripesh, V., Yoon, S.W. (2008). Bed of nails - 100-μm-pitch wafer-level interconnections process. IEEE Transactions on Electronics Packaging Manufacturing 31 (4) : 333-340. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2008.2004500 1521334X http://scholarbank.nus.edu.sg/handle/10635/84883 000260332500008 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Failure analysis
Packaging
Photolithography
Reliability
spellingShingle Failure analysis
Packaging
Photolithography
Reliability
Vempati, S.R.
Tay, A.A.O.
Kripesh, V.
Yoon, S.W.
Bed of nails - 100-μm-pitch wafer-level interconnections process
description 10.1109/TEPM.2008.2004500
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Vempati, S.R.
Tay, A.A.O.
Kripesh, V.
Yoon, S.W.
format Article
author Vempati, S.R.
Tay, A.A.O.
Kripesh, V.
Yoon, S.W.
author_sort Vempati, S.R.
title Bed of nails - 100-μm-pitch wafer-level interconnections process
title_short Bed of nails - 100-μm-pitch wafer-level interconnections process
title_full Bed of nails - 100-μm-pitch wafer-level interconnections process
title_fullStr Bed of nails - 100-μm-pitch wafer-level interconnections process
title_full_unstemmed Bed of nails - 100-μm-pitch wafer-level interconnections process
title_sort bed of nails - 100-μm-pitch wafer-level interconnections process
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/84883
_version_ 1781784530584076288

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