Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

10.1016/j.chemosphere.2006.02.010

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Bibliographic Details
Main Authors:	Liao, E.B., Tay, A.A.O., Ang, S.S., Feng, H.H., Nagarajan, R., Kripesh, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Compliance Electrical parasitic Flip-chip Multicopper-column interconnect Wafer-level packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60918
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-60918
record_format	dspace
spelling	sg-nus-scholar.10635-609182024-11-14T00:35:48Z Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging Liao, E.B. Tay, A.A.O. Ang, S.S. Feng, H.H. Nagarajan, R. Kripesh, V. MECHANICAL ENGINEERING Compliance Electrical parasitic Flip-chip Multicopper-column interconnect Wafer-level packaging 10.1016/j.chemosphere.2006.02.010 IEEE Transactions on Advanced Packaging 29 2 343-353 ITAPF 2014-06-17T06:28:52Z 2014-06-17T06:28:52Z 2006-05 Article Liao, E.B., Tay, A.A.O., Ang, S.S., Feng, H.H., Nagarajan, R., Kripesh, V. (2006-05). Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging. IEEE Transactions on Advanced Packaging 29 (2) : 343-353. ScholarBank@NUS Repository. https://doi.org/10.1016/j.chemosphere.2006.02.010 15213323 http://scholarbank.nus.edu.sg/handle/10635/60918 000241135600019 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Compliance Electrical parasitic Flip-chip Multicopper-column interconnect Wafer-level packaging
spellingShingle	Compliance Electrical parasitic Flip-chip Multicopper-column interconnect Wafer-level packaging Liao, E.B. Tay, A.A.O. Ang, S.S. Feng, H.H. Nagarajan, R. Kripesh, V. Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
description	10.1016/j.chemosphere.2006.02.010
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Liao, E.B. Tay, A.A.O. Ang, S.S. Feng, H.H. Nagarajan, R. Kripesh, V.
format	Article
author	Liao, E.B. Tay, A.A.O. Ang, S.S. Feng, H.H. Nagarajan, R. Kripesh, V.
author_sort	Liao, E.B.
title	Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
title_short	Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
title_full	Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
title_fullStr	Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
title_full_unstemmed	Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
title_sort	numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60918
_version_	1821199033159385088

Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging

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