Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling
10.1109/TCAPT.2006.880509
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2014
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sg-nus-scholar.10635-602992023-10-25T20:24:39Z Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. MECHANICAL ENGINEERING Flip-chip Multicopper-column (MCC) interconnect Solder bridging Soler joint shape Terms-Fatigue Wafer-level packaging 10.1109/TCAPT.2006.880509 IEEE Transactions on Components and Packaging Technologies 29 3 560-569 ITCPF 2014-06-17T06:21:34Z 2014-06-17T06:21:34Z 2006-09 Article Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V. (2006-09). Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling. IEEE Transactions on Components and Packaging Technologies 29 (3) : 560-569. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2006.880509 15213331 http://scholarbank.nus.edu.sg/handle/10635/60299 000240242700016 Scopus |
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NUS Library |
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Asia |
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Singapore Singapore |
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| topic |
Flip-chip Multicopper-column (MCC) interconnect Solder bridging Soler joint shape Terms-Fatigue Wafer-level packaging |
| spellingShingle |
Flip-chip Multicopper-column (MCC) interconnect Solder bridging Soler joint shape Terms-Fatigue Wafer-level packaging Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| description |
10.1109/TCAPT.2006.880509 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. |
| format |
Article |
| author |
Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. |
| author_sort |
Liao, E.B. |
| title |
Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| title_short |
Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| title_full |
Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| title_fullStr |
Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| title_full_unstemmed |
Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| title_sort |
fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/60299 |
| _version_ |
1781781808686301184 |