Modelling fatigue life of solder joints in wafer level packages

Master's

Saved in:
Bibliographic Details
Main Author: CHNG CHIA-K'AI, AUDREY
Other Authors: MECHANICAL ENGINEERING
Format: Theses and Dissertations
Language:English
Published: 2010
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/13618
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Language: English
id sg-nus-scholar.10635-13618
record_format dspace
spelling sg-nus-scholar.10635-136182015-01-15T20:33:31Z Modelling fatigue life of solder joints in wafer level packages CHNG CHIA-K'AI, AUDREY MECHANICAL ENGINEERING TAY AH ONG, ANDREW LIM KIAN MENG Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect Master's MASTER OF ENGINEERING 2010-04-08T10:34:48Z 2010-04-08T10:34:48Z 2004-01-20 Thesis CHNG CHIA-K'AI, AUDREY (2004-01-20). Modelling fatigue life of solder joints in wafer level packages. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/13618 NOT_IN_WOS en
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
language English
topic Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect
spellingShingle Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect
CHNG CHIA-K'AI, AUDREY
Modelling fatigue life of solder joints in wafer level packages
description Master's
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
CHNG CHIA-K'AI, AUDREY
format Theses and Dissertations
author CHNG CHIA-K'AI, AUDREY
author_sort CHNG CHIA-K'AI, AUDREY
title Modelling fatigue life of solder joints in wafer level packages
title_short Modelling fatigue life of solder joints in wafer level packages
title_full Modelling fatigue life of solder joints in wafer level packages
title_fullStr Modelling fatigue life of solder joints in wafer level packages
title_full_unstemmed Modelling fatigue life of solder joints in wafer level packages
title_sort modelling fatigue life of solder joints in wafer level packages
publishDate 2010
url http://scholarbank.nus.edu.sg/handle/10635/13618
_version_ 1681078888567930880