Modelling fatigue life of solder joints in wafer level packages
Master's
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Language: | English |
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2010
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/13618 |
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sg-nus-scholar.10635-136182015-01-15T20:33:31Z Modelling fatigue life of solder joints in wafer level packages CHNG CHIA-K'AI, AUDREY MECHANICAL ENGINEERING TAY AH ONG, ANDREW LIM KIAN MENG Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect Master's MASTER OF ENGINEERING 2010-04-08T10:34:48Z 2010-04-08T10:34:48Z 2004-01-20 Thesis CHNG CHIA-K'AI, AUDREY (2004-01-20). Modelling fatigue life of solder joints in wafer level packages. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/13618 NOT_IN_WOS en |
institution |
National University of Singapore |
building |
NUS Library |
country |
Singapore |
collection |
ScholarBank@NUS |
language |
English |
topic |
Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect |
spellingShingle |
Finite element method, macro-micro modelling, eutectic lead-tin solder, fatigue, wafer level packaging, interconnect CHNG CHIA-K'AI, AUDREY Modelling fatigue life of solder joints in wafer level packages |
description |
Master's |
author2 |
MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING CHNG CHIA-K'AI, AUDREY |
format |
Theses and Dissertations |
author |
CHNG CHIA-K'AI, AUDREY |
author_sort |
CHNG CHIA-K'AI, AUDREY |
title |
Modelling fatigue life of solder joints in wafer level packages |
title_short |
Modelling fatigue life of solder joints in wafer level packages |
title_full |
Modelling fatigue life of solder joints in wafer level packages |
title_fullStr |
Modelling fatigue life of solder joints in wafer level packages |
title_full_unstemmed |
Modelling fatigue life of solder joints in wafer level packages |
title_sort |
modelling fatigue life of solder joints in wafer level packages |
publishDate |
2010 |
url |
http://scholarbank.nus.edu.sg/handle/10635/13618 |
_version_ |
1681078888567930880 |