Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading
10.1016/j.scriptamat.2008.08.020
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Main Authors: | Seah, S.K.W., Wong, E.H., Shim, V.P.W. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/60301 |
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Institution: | National University of Singapore |
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