Using nanoparticles and carbon nanotubes to enhance the properties of a lead-free solder

• Main Authors: Nai, S.M.L., Han, Y.D., Jing, H.Y., Tan, C.M., Wei, J., Gupta, M.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Carbon nanotubes; Composites; Lead-free solder; Nanoparticles
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/86108
• Institution: National University of Singapore

Technical Proceedings of the 2009 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2009